RRP Electronics signs pact with AMB of Taiwan for memory chip production

RRP Electronics signs pact with AMB of Taiwan for memory chip production


RRP Electronics, a leading player in the semiconductor industry, has signed a Memorandum of Understanding with AMB, Taiwan for production of advanced Memory Modules including SPI Nand, Micro SD, EMMC and SSD technologies.

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The partnership is projected to generate $25 million in annual revenue and marks a significant milestone in the global semiconductor ecosystem.

The agreement encompasses comprehensive technology sharing, including package structure details, substrate designs, test program development and tool design support.

With extended capacities starting from 2GB onwards, the new memory solutions will cater to increasing demand in the global electronics market.

Rajendra Chodankar, Chairman, RRP Electronics said through this association, the company will deploy modern technology at OSAT facility to serve leading corporate giants such as Samsung and other major players.

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The collaboration sets the stage for delivering $25 million in revenue annually and further positions the company as a global leader in semiconductor innovation, he said

The production will take place at RRP Electronics’ 40,000 sq. ft. Outsourced Semiconductor Assembly and Test facility at Mahape in the outskirts of Mumbai.

To meet growing demand, the company is also expanding its manufacturing footprint with new production lines at its upcoming plant at MIDC, Taloja. It will commence operations in the two years.





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